Publication date: 30 June 2017
Source:Thin Solid Films, Volume 632
Author(s): Jin-Jin Wang, Hong Hu, Cheng-Huo Shang
In this study, a nickel thermistor pattern integrated with copper electrodes on polyimide substrate is fabricated by photolithography and magnetron sputtering techniques. The effect of annealing treatment on the performance of the nickel thermistor on polyimide substrate is evaluated. It is found that the performance of nickel thermistor is significantly improved by annealing treatment. The relative change of resistance increases with the increasing annealing temperature and time when the annealing temperature is below 360
Source:Thin Solid Films, Volume 632
Author(s): Jin-Jin Wang, Hong Hu, Cheng-Huo Shang