Publication date: 30 September 2017
Source:Thin Solid Films, Volume 638
Author(s): Cheng-Da Wu, Wen-Xiang Jiang
The effects of temperature and tensile velocity on the mechanical properties and mechanics of Au/Cu/Au/Cu nanofilms under tensile testing are studied using molecular dynamics simulations based on the many-body embedded-atom potential. The simulation results show that at the initial tensile deformation, dislocations nucleate at layer interfaces, propagate along close-packed plane {111} toward the interior of the film, and are then terminated by layer interfaces, which act as a barrier. The proportions of atoms in face-centered cubic and hexagonal close-packed structures during tensile deformation decrease and that in other structures (disordered atoms) increases when the temperature increases from 273 to 700
Source:Thin Solid Films, Volume 638
Author(s): Cheng-Da Wu, Wen-Xiang Jiang