Publication date: 1 February 2018
Source:Thin Solid Films, Volume 647
Author(s): Yejin Shin, Inyoung Kim, Dongho Oh, Taik-Min Lee
Among the printing processes for printed electronic devices, the gravure offset and reverse offset methods have drawn attention for their fine pattern printing potential. These printing methods use a cliché, which has a decisive effect on the precision and quality of the final product. In this research, a precise cliché replica method is proposed. It consists of copper (Cu) sputtering, precise reverse offset printing with a 5-μm pattern width, nickel‑cobalt (Ni-Co) electroplating, rinsing, etching, and diamond-like carbon (DLC) coating. Cu is deposited on glass by sputtering to a thickness of 3
Source:Thin Solid Films, Volume 647
Author(s): Yejin Shin, Inyoung Kim, Dongho Oh, Taik-Min Lee