Synchrotron X-ray diffraction topography study of bonding-induced strain in silicon-on-insulator wafers

Publication date: Available online 2 March 2016
Source:Thin Solid Films
Author(s): A. Lankinen, T.O. Tuomi, P. Kostamo, H. Jussila, S. Sintonen, H. Lipsanen, M. Tilli, J. Mäkinen, A.N. Danilewsky
Large-area back-reflection and transmission X-ray diffraction topographs of bonded silicon-on-insulator (SOI) wafers made with synchrotron radiation allowed direct and simultaneous imaging of bonding-induced strain patterns of both the 7m thick (011) top layers and the (001) Si substrates of the SOI structures. The bonding-induced strain pattern consists of cells having a diameter of about 40m. Section topographs show a lattice misorientation of the adjacent cells of about 0.001° and the maximum observed strain-induced lattice plane rotation ten times larger, i.e. about 0.01°. Topographs made after etching away the insulator layer show no indication of residual strain or defects either in the silicon-on-insulator layer or in the substrate. This is in agreement with the experimentally determined maximum bonding stress of 30MPa, which is much smaller than the estimated stress needed to nucleate dislocations.