Achieving uniform layer deposition by atmospheric-pressure plasma-enhanced chemical vapor deposition

Publication date: 31 December 2015
Source:Thin Solid Films, Volume 597
Author(s): Jae-Ok Lee, Woo Seok Kang, Min Hur, Jin Young Lee, Young-Hoon Song
This work investigates the use of plasma-enhanced chemical vapor deposition under atmospheric pressure for achieving uniform layer formation. Electrical and optical measurements demonstrated that the counterbalance between oxygen and precursors maintained the homogeneous discharge mode, while creating intermediate species for layer deposition. Several steps of the deposition process of the layers, which were processed on a stationary stage, were affected by flow stream and precursor depletion. This study showed that by changing the flow streamlines using substrate stage motion uniform layer deposition under atmospheric pressure can be achieved.