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Electrodeposition of ReNi alloys from aqueous solutions with organic additives

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Publication date: Available online 6 October 2016
Source:Thin Solid Films
Author(s): Wangping Wu, Noam Eliaz, Eliezer Gileadi
In this study, ReNi alloys with high Re content were electrodeposited on copper substrates from aqueous solutions containing additives with a combination of vanillin, sodium lauryl sulfate and gelatin. The bath additives were found to have a significant effect on the chemical composition, surface morphology and cracking pattern. The morphology of the alloy was changed from uniformly smooth without additives to relatively coarse-grained with three additives. The deposition rate and crack density decreased when additives were added to a bath containing 34mM Re O 4 , 124mM Ni2+ and 343mM [Cit]3. Almost pure Re films were formed at low Ni2+ concentration of 30–50mM due to the effect of additives; however, the deposited film was thin. A thin layer of Re oxide, a new Re-O-C-complex state and some organic residues from additives were formed at the surface of the Re film. Both the Re-rich alloy and the Re film were found to have an amorphous structure.


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