Publication date: 31 January 2017
Source:Thin Solid Films, Volume 622
Author(s): Q. Qiao, Y.W. Li, J.Z. Zhang, Z.G. Hu, J.H. Chu
Bismuth oxide thin films have been produced from the precursor of triphenyl bismuth and ozone by using the atomic layer deposition (ALD) technique. The growth rate of 0.23 Å/cycle is independent to deposition temperature at the range of 250 °C to 320 °C, and the self-limiting saturated adsorption of ALD for bismuth-source and oxygen-source precursors was verified. The films obtained in the ALD window (between 250 °C and 320 °C) have an indirect band gap of ~ 2.77 eV that is compatible with Bi2 O3 − δ . High-resolution transmission electron microscopy reveals a mixed growth mode, horizontal growth initially, and subsequent vertical/island growth during the deposition process.
Source:Thin Solid Films, Volume 622
Author(s): Q. Qiao, Y.W. Li, J.Z. Zhang, Z.G. Hu, J.H. Chu