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Experimental investigations of the bismuth oxide film grown by atomic layer deposition using triphenyl bismuth

Publication date: 31 January 2017
Source:Thin Solid Films, Volume 622
Author(s): Q. Qiao, Y.W. Li, J.Z. Zhang, Z.G. Hu, J.H. Chu
Bismuth oxide thin films have been produced from the precursor of triphenyl bismuth and ozone by using the atomic layer deposition (ALD) technique. The growth rate of 0.23Å/cycle is independent to deposition temperature at the range of 250°C to 320°C, and the self-limiting saturated adsorption of ALD for bismuth-source and oxygen-source precursors was verified. The films obtained in the ALD window (between 250°C and 320°C) have an indirect band gap of ~2.77eV that is compatible with Bi2O3 δ . High-resolution transmission electron microscopy reveals a mixed growth mode, horizontal growth initially, and subsequent vertical/island growth during the deposition process.


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