Temperature coefficient of resistance and thermal expansion coefficient of 10-nm thick gold films

Publication date: 1 February 2017
Source:Thin Solid Films, Volume 623
Author(s): A.I. Oliva, J.M. Lugo, R.A. Gurubel-Gonzalez, R.J. Centeno, J.E. Corona, F. Avilés
A methodology to simultaneously estimate the temperature coefficient of resistance (α R ) and the thermal expansion coefficient (α T ) of metallic films with thickness in the nanometric range in a film/substrate system is discussed. An analytical model which takes into account the thermo-resistivity and the piezo-resistivity effects to estimate α R and α T of metallic films from experimental data obtained at room conditions is proposed. The methodology is first validated by using 100-nm thick Au films which yields values close to the bulk, providing confidence on the reported values. The proposed methodology was used to obtain α R and α T of 10-nm thick Au films deposited by thermal evaporation with three deposition rates onto two substrates. The results show that for 10-nm thick Au films α R presents similar values than previous reports, meanwhile α T is between 5 and 6 times higher than the corresponding bulk value; the arrangement of the atoms during the films deposition yields only minor variation in such a thermal parameter.