Low-frequency ‘delay time’ ultrasound and its effect on electroless Cu metallisation of a Pd activated dielectric material

Publication date: 31 December 2015
Source:Thin Solid Films, Volume 597
Author(s): Andrew J. Cobley, Ignacio Tudela, Bahaa Abbas, Bilal Mkhlef
The effect that the presence of low-frequency ultrasound has on the deposition rate of an electroless Cu plating process for the metallisation of a Pd activated dielectric material has been preliminarily studied. Continuous ultrasound during electroless Cu plating had little effect on the deposition rate compared with the standard process under mechanical agitation due to the detrimental effect of cavitation on removing Pd from the dielectric materials. However, the introduction of a ‘delay time’ prior to the introduction of ultrasound resulted in an increase of the deposition rate of up to 26% (7-min delay time) and suggested that low frequency ultrasound could enable a reduction in electroless copper operating temperatures without a significant decrease in plating rate. Cu coatings produced in such conditions exhibited a significantly enhanced surface coverage with reduced porosity without any undesired effect on the crystal structure.